(805) 277-9118 Fax : (805) 277-7884

BGA and Surface Mount Heatsinks

Thermal Solutions International, Inc. also specializes in low power surface mount and BGA (Ball Grid Array) Heatsinks. 

BGA AND SURFACE MOUNT HEATSINKS

TSI offers a wide range of board level heat sinks for IC (Integrated Circuit) packages such as BGA and DIP packages and discrete power semiconductor packages. We carry heatsinks for the following JEDEC outlines

TO-202

TO-218

TO-220

TO-247

TO-262

TO-263

BGA and Surface Mount Heatsinks
More information
These heatsinks are offered in either stamped or extruded aluminum form and can be plated to any surface finish required. See our plating page for a complete list of our plating finishes. We also carry various attachment methods including clips and double sided thermally conductive tapes and can integrate them for you prior to shipment. Please contact us with any questions or any custom heatsinks designs you may have.

contact us

5 + 4 =

Captcha:

BGA and Surface Mount Heatsinks

Office

12076 Palmer Drive
Moorpark, CA 93021
USA

Hours

Monday - Friday

8:00 a.m. to 5:00 p.m. pst

Call Us

(805) 277-9118

BGA and Surface Mount Heatsinks

© Copyright 2019 Thermal Solutions International, Inc. All Rights Reserved.